Wafer Grinder and CMP Tools

Agency: DEPT OF DEFENSE
State: District of Columbia
Type of Government: Federal
FSC Category:
  • 36 - Special Industry Machinery
NAICS Category:
  • 333242 - Semiconductor Machinery Manufacturing
Set Aside: Total Small Business Set-Aside (FAR 19.5)
Posted Date: Jan 28, 2025
Due Date: Feb 14, 2025
Solicitation No: N0017325QMB04
Original Source: Please Login to View Page
Contact information: Please Login to View Page
Bid Documents: Please Login to View Page

Description

Follow
Wafer Grinder and CMP Tools
Active
Contract Opportunity
Notice ID
N0017325QMB04
Related Notice
N0017325RFIMB08
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE NAVY
Major Command
ONR
Sub Command
ONR NRL
Office
NAVAL RESEARCH LABORATORY
Looking for contract opportunity help?

APEX Accelerators are an official government contracting resource for small businesses. Find your local APEX Accelerator (opens in new window) for free government expertise related to contract opportunities.

APEX Accelerators are funded in part through a cooperative agreement with the Department of Defense.

The APEX Accelerators program was formerly known as the Procurement Technical Assistance Program (opens in new window) (PTAP).

General Information View Changes
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Updated)
  • Updated Published Date: Jan 28, 2025 08:22 am EST
  • Original Published Date: Jan 23, 2025 08:16 am EST
  • Updated Date Offers Due: Feb 14, 2025 12:00 pm EST
  • Original Date Offers Due: Feb 07, 2025 12:00 pm EST
  • Inactive Policy: 15 days after date offers due
  • Updated Inactive Date: Mar 01, 2025
  • Original Inactive Date: Feb 22, 2025
  • Initiative:
    • None
Classification
  • Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
  • Product Service Code: 3670 - SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY
  • NAICS Code:
    • 333242 - Semiconductor Machinery Manufacturing
  • Place of Performance:
    Washington , DC 20375
    USA
Description View Changes

See attached combined Synopsis/Solicitation and System Specifications.



Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.



Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025



Amendment #2 responds to a question and posts a revised combined Synopsis/Solicitation changing the due date for offers to 2/14/2025.



Q. Regarding the RFQ for grind and CMP tools for Silicon Carbide – does the NRL intend to provide wafers for potential contractors to perform demonstrations, or are you just looking for data from previous demonstrations?



R. NRL will provide wafers for potential contractors to perform the demonstrations.


Attachments/Links
Contact Information View Changes
Contracting Office Address
  • 4555 OVERLOOK AVE SW
  • WASHINGTON , DC 20375-5328
  • USA
Primary Point of Contact
Secondary Point of Contact


History

Related Document

Jan 23, 2025[Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools
Jan 30, 2025[Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools
Jan 31, 2025[Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools
Get Government Bids Like This by Email Receive daily bid alerts that match your keywords, business categories, and target regions.
View Sample Report Start Free Trial
* Disclaimer: This website provides information about bids, requests for proposals (RFPs), or requests for qualifications (RFQs) for convenience only and does not serve as an official public notice. Individuals who wish to respond to or inquire about bids, RFPs, or RFQs should contact the relevant government department directly.