Wafer Grinder and CMP Tools

Agency: DEPT OF DEFENSE
State: District of Columbia
Type of Government: Federal
FSC Category:
  • 36 - Special Industry Machinery
NAICS Category:
  • 333242 - Semiconductor Machinery Manufacturing
Posted Date: Jan 3, 2025
Due Date: Jan 14, 2025
Solicitation No: N0017325RFIMB08
Original Source: Please Login to View Page
Contact information: Please Login to View Page
Bid Documents: Please Login to View Page

Description

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Wafer Grinder and CMP Tools
Active
Contract Opportunity
Notice ID
N0017325RFIMB08
Related Notice
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE NAVY
Major Command
ONR
Sub Command
ONR NRL
Office
NAVAL RESEARCH LABORATORY
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General Information
  • Contract Opportunity Type: Sources Sought (Original)
  • Original Published Date: Jan 03, 2025 02:46 pm EST
  • Original Response Date: Jan 14, 2025 12:00 pm EST
  • Inactive Policy: 15 days after response date
  • Original Inactive Date: Jan 29, 2025
  • Initiative:
    • None
Classification
  • Original Set Aside:
  • Product Service Code: 3670 - SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY
  • NAICS Code:
    • 333242 - Semiconductor Machinery Manufacturing
  • Place of Performance:
    Washington , DC 20375
    USA
Description

see attached RFI & Product Specifications


Attachments/Links
Contact Information
Contracting Office Address
  • 4555 OVERLOOK AVE SW
  • WASHINGTON , DC 20375-5328
  • USA
Primary Point of Contact
Secondary Point of Contact


History
  • Jan 03, 2025 02:46 pm ESTSources Sought (Original)
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