UP-Microchip Packaging Cleanroom Renovation
| Agency: | Pennsylvania State University |
|---|---|
| State: | Pennsylvania |
| Type of Government: | State & Local |
| Posted Date: | Jul 22, 2025 |
| Due Date: | Aug 21, 2025 |
| Solicitation No: | 00-08958.00 |
| Original Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
CURRENT - Bid Package #2: Cleanroom renovation and expansion at Millennium Sciences Building.
AWARDED - Bid Package #1: Construction of the new micro-electronic systems packaging research laboratory.
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.
Contact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for Prequalification Criteria.
Contact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for Bid Documents.
The Form of Proposal, Form of Contract, Plans and Specifications, and other Contract Documents will be distributed to bidders through Alexander Building Construction Co.'s online bidding platform, PreconSuite (formerly Pipeline).
| Package Number | Package Name | Pre-Bid Date/Time | Pre-Bid Meeting | Bid Date/Time | Awarded To | Document |
| 1.01 | DA Mechanical and Plumbing | 01/09/2025 - 03:00 pm | McClure Company | |||
| 1.02 | DA Electrical | 01/09/2025 - 03:00 pm | Top Ridge | |||
| 2.01 | Misc. Metals, General Trades, Interior Partitions & Ceilings | 08/07/2025 - 01:00 pm | Recommended but not Mandatory | 08/21/2025 - 03:00 pm | ||
| 2.02 | Cleanroom Wall Panel System | 08/07/2025 - 01:00 pm | Recommended but not Mandatory | 08/21/2025 - 03:00 pm | ||
| 2.03 | Flooring & Tiling | 08/07/2025 - 01:00 pm | Recommended but not Mandatory | 08/21/2025 - 03:00 pm | ||
| 2.04 | Painting | 08/07/2025 - 01:00 pm | Recommended but not Mandatory | 08/21/2025 - 03:00 pm | ||
| 2.05 | Fire Protection | 08/07/2025 - 01:00 pm | Recommended but not Mandatory | 08/21/2025 - 03:00 pm |
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See Also
Follow Cushion Packaging Material LTC for DLA Active Contract Opportunity Notice ID SP330025Q5012
DEPT OF DEFENSE
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Follow SHIPPING AND STORAG Active Contract Opportunity Notice ID SPRPA1-26-R-VB75 Related Notice Department/Ind.
Federal Agency
Bid Due: 7/13/2026
Number Type Date Added Start Date Q&A Deadline Due Date Status Purchasing Group
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Bid Due: 7/01/2026