UP-Microchip Packaging Cleanroom Renovation

Agency: Pennsylvania State University
State: Pennsylvania
Type of Government: State & Local
Posted Date: Dec 7, 2024
Due Date: Jan 2, 2025
Solicitation No: 00-08958.00
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Description

Project Number
00-08958.00
Project Status
Trade/Bid Packages
Complete - Architect/Engineer and Design/Build Selection
Complete - Construction Manager Selection and Other Services
Campus
University Park
Project Stage
RFP
Project Description

Construction of the new micro electronic systems packaging research laboratory.

The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).

The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.

Penn State Project Leader Name, Email
Architect/ Engineer and Design Build Selection
Capital Project (>$10M)
Yes
Project Stage for Architect/Engineer and Design/Build Selection
Appointment Complete
Date of Appointment Selection
Oct 19, 2023
Professional Consultant
Company Name
Stantec Architecture and Engineering LLC
Contact Name
George Rieke
Phone
(412) 394-7042
Email
George.Rieke@stantec.com
Construction Manager Selection and Other Services
Project Stage for Construction Manager Selection and Other Services
Awarded
Attachments for Construction Manager Selection and Other Services
CM Firm
Company Name
Alexander Building Construction Co.
Contact Name
Dennis Walter
Phone
(814) 931-0780
Email
dennis.walter@butz.com
Trade/Bid Package Information
Project Stage for Trade/Bid Package Information
RFP
Prequalification
Bid Due Date and Time
01/02/2025 - 03:00 pm
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