Agency: | Pennsylvania State University |
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State: | Pennsylvania |
Type of Government: | State & Local |
NAICS Category: |
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Posted Date: | Apr 14, 2023 |
Due Date: | May 5, 2023 |
Solicitation No: | 00-08958.00 |
Bid Source: | Please Login to View Page |
Contact information: | Please Login to View Page |
Bid Documents: | Please Login to View Page |
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.
EEW Room 113 Cleanroom Study RPT_000895800_EEW-MSC-CR_90__20230112.pdf
Attachment | Size |
Attachment | Size |
Request for Letter of Interest | 170.82 KB |
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