Thin-Film Thickness Measurement System

This Request for Proposals (the “RFP”) is an invitation by the University of Ottawa (the “University”) to prospective proponents to submit proposals for a Thin-Film Thickness Measurement System, funded by the Canada Foundation for Innovation and the Ontario Research Fund, as further described in Appendix D (RFP Particulars) Section A (the “Deliverables”).
The University seeks proposals from qualified vendors for the supply, delivery, installation, commissioning, and training of a Thin-Film Thickness Measurement System. The system will be used for the routine characterization of thin films, including step-height thickness measurement, surface roughness analysis, and film stress measurement across a variety of substrates, including but not limited to silicon wafers, compound semiconductors, glass, metals, and polymers

Mandatory Technical Specifications Requirements:
1.0 - Performance

1.1 - Direct surface height measurement must be done by stylus or tip-type scanner.

1.2 - The step-height resolution must be and must support a measurement of step heights from ≤30 nm to ≥5 µm

1.3 - The system must provide quantitative roughness parameters, for example Ra, Rq, Rz, or RMS roughness.

1.4 - The system must accommodate planar samples at least 50 mm or larger (2 inch) diameter or equivalent rectangular area, with ability to measure smaller pieces.

1.5 - The system must have a motorized stage for X-Y-positioning and Z-control of the measurement head/assembly.

1.6 - The measurement head must be automatically approached toward a sample by the software without damaging tip/stylus.

1.7 - The system must integrate a camera both for positioning a stylus and measurement location. Either top-view or side-view will be accepted

1.8 - The system must provide selectable stylus force with low-force capability ≤ 1 mg.

1.9 - Anti-vibration table must come with the tool directly through the supplier or third-party part must be provided to the supplier.

1.10 - The system must support a scan length of ≥50 mm in a single scan, with an available capability (e.g., stitching) to reach up to 100 mm

2.0 - Software

2.1 - The system must come with software license (perpetual or term based) for tool-control, data acquisition, analysis, and exporting data and images in common formats. (e.g., CSV, TXT, JPG, TIFF, PNG, etc)

2.2 - The hard-drives must be solid-state-drive and one operating SSD (no specific capacity) and one data saving SSD (1TB) must be installed in the computer.

2.3 - The supplier must provide installation files to restore the thickness measurement functionalities in case of hard drive failure or must provide the solution for hard drive failure.

2.4 - Software must be compatibility to Windows 11.

3.0 - Warranty and Maintenance

3.1 - Must include 1-year standard manufacturer’s warranty.

3.2 - The supplier must include delivery, and on-site installation, commissioning and training. Supplier must agree to video-recording of the training session(s) for the purpose of future user training.

3.3 - CSA certification or equivalent is required, as per the Electrical Safety Authority Recognized Certification Mark:
https://esasafe.com/electrical-products/recognized-certification-marks/ .

If any electrical components do not arrive with an acceptable certification marking, the University must be allowed to open/modify the instrument as required in order to have it CSA Certified. Said inspection/modification, if required, must not void any warranty.

4.0 - References

4.1 - Must provide customer references for installed equipment of same model/series (Please refer to Appendix E – Reference Consent Form).

Bidding and Documents are available on http://www.merx.com . Fees may apply; See https://www.merx.com/public/pricing for more information.

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