Subscription Service: Market and Packaging Technology Trends

BACKGROUND

***THIS IS A COMBINED SOURCES SOUGHT NOTICE AND NOTICE OF INTENT TO SOLE SOURCE***

The National Institute of Standards and Technology (NIST)’s mission is to promote U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. As part of NIST, the CHIPS Research and Development (R&D) goals include accelerating ideas to market, where the best ideas achieve commercial scale as quickly and cost effectively as possible. To carry out the mission, CHIPS R&D requires a subscription that delivers the latest developments in packaging technologies, particularly those related to Ball Grid arrays(BGAs), Chip Scale Packages (CSPs), Stacked Die CSPs, Flip Chip, Wafer Level Packages, substrates, chiplets, Co-design/EDA, equipment and processes. The subscription will be used by CHIPs R&D program to stay competitive and informed in the rapidly evolving semiconductor and electronics industry.

If no alternate sources are identified, the Government intends to issue a Sole Source Award to Techsearch International, Inc. (4801 Spicewood Springs Rd., STE 150 Austin, TX 78759-8480) under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 541690, Other Scientific and Technical Consulting Services.

SEE ATTACHED DOCUMENT FOR SPECIFIC REQUIREMENTS