Reactive Ion Etch (RIE) System
| Agency: | The New York State Contract Reporter |
|---|---|
| State: | New York |
| Type of Government: | State & Local |
| NAICS Category: |
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| Posted Date: | Jan 14, 2025 |
| Due Date: | Feb 5, 2025 |
| Original Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
Description
Description: The State University of New York at Buffalo is submitting an Invitation for Bid (IFB) to purchase a Reactive Ion Etch (RIE) System. The RIE system will provide etch capability for semiconductor materials such as silicon-based dielectrics, as well as novel research-grade materials. This flexibility will allow for student instruction in modern silicon processing, while enabling research with advanced materials such as gallium oxide. The system will need to provide support for small fragment-sized samples, as well as up to 100mm substrates. The RIE System is to be located at the University’s North Campus building, Davis Hall. See IFB documents attached to this ad for complete specifications and instructions to bidders. Please bookmark this ad and “watch” for updates. Proposal due date/time: Wednesday, February 5, 2025 at 2:30 pm EST. Due Date: 02/05/2025 2:30 PMContract Term: Immediate Location: University at Buffalo North Campus Ad Type: General
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