| Agency: | State Government of Vermont |
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| State: | Vermont |
| Type of Government: | State & Local |
| NAICS Category: |
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| Posted Date: | Apr 23, 2026 |
| Due Date: | May 20, 2026 |
| Original Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
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Bid Type: Job Contract Locations: Windsor Keywords: Paving Contractor Bid Description: Community Newspaper Advertisement Weathersfield Center Road Paving & Chip Seal Project The Town of Weathersfield, VT is accepting bids from qualified paving and chip seal contractors for paving and chip seal work on Weathersfield Center Road. The project includes milling, asphalt pavement overlay, crack filling, 10% rubber chip seal with 3/8” stone application, traffic control, sweeping, and associated work as outlined in the Request for Bids. There will be no mandatory pre-bid meeting; however, the Town encourages all bidders to view the project locations prior to submitting a bid. Questions regarding the project should be directed to Ray Stapleton, Highway Superintendent, at highway@weathersfield.org or (802) 263-5272. The question period for this project ends on May 14, 2026 at 4:00 PM. Final addenda and responses to submitted questions will be distributed on May 15, 2026 at 2:00 PM. Sealed bids are due on May 20, 2026 by 2:00 PM at the Weathersfield Town Hall. Envelopes must be clearly labeled: “Weathersfield Chip Seal Bids” Bids must be delivered to: Attn: Brandon Gulnick, Town Manager Town of Weathersfield 5259 US Route 5 (P.O. Box 550) Weathersfield, VT 05030 Faxed or emailed bids will not be accepted. Paving work must be completed by July 24, 2026, and chip seal work must be completed between August 10, 2026 and September 1, 2026. Liquidated damages may apply for delayed completion beyond September 10, 2026. The Town reserves the right to accept or reject any or all bids and to award the contract in the best interest of the Town. Brandon Gulnick Town Manager Weathersfield, VT Paving work must be completed by July 24, 2026, and chip seal work must be completed between August 10, 2026 and September 1, 2026. Liquidated damages may apply for delayed completion beyond September 10, 2026.
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