Next-Generation Microelectronics Manufacturing (NGMM) Summit
| Agency: | DEPT OF DEFENSE |
|---|---|
| State: | Federal |
| Type of Government: | Federal |
| FSC Category: |
|
| NAICS Category: |
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| Posted Date: | Jul 14, 2025 |
| Due Date: | Oct 6, 2025 |
| Solicitation No: | DARPA-SN-25-85 |
| Original Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
Description
Follow
Active
Contract Opportunity
Notice ID
DARPA-SN-25-85
Related Notice
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA)
Office
DEF ADVANCED RESEARCH PROJECTS AGCY
General Information
Classification
Description
Contact Information
History
- Contract Opportunity Type: Special Notice (Original)
- Original Published Date: Jul 14, 2025 03:21 pm EDT
- Original Response Date: Oct 06, 2025 11:59 pm EDT
- Inactive Policy: Manual
- Original Inactive Date: Oct 29, 2025
-
Initiative:
- None
- Original Set Aside:
- Product Service Code: AC13 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; EXPERIMENTAL DEVELOPMENT
-
NAICS Code:
- 541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
-
Place of Performance:
The Defense Advanced Research Projects Agency (DARPA) will host the first annual Next-Generation Microelectronics Manufacturing Summit (NGMM) to convene stakeholders from across defense, academia, and industry to learn more about the program and how they can utilize the capability in the future to support their research, prototyping programs, and product fabrication.
Highlights include:
• Inside NGMM: Early customer/partner engagement, program timeline, and ways to get involved in three-dimensional multi-material, heterogeneously integrated (3DHI) research and development (R&D) and prototyping.
• Technology roadmap: Overview of 3DHI technology roadmap and design/development infrastructure.
• Progress in action: Hear the latest on facility, infrastructure, equipment, and key milestones in process development.
This in-person meeting will be held on October 27–28, 2025, at The University of Texas at Austin’s AT&T Hotel and Conference Center from 8:30 a.m. to 5:00 p.m. CT on October 27, and from 8:30 a.m. to 1:30 p.m. CT on October 28, 2025.
The NGMM Summit will include overview presentations by government, industry, and academic personnel. There will be time allotted for discussions and networking amongst the participants.
All presentations and discussions will be held at the UNCLASSIFIED level. All attendees are required to present government-issued photo identification upon entry to the event.
Highlights include:
• Inside NGMM: Early customer/partner engagement, program timeline, and ways to get involved in three-dimensional multi-material, heterogeneously integrated (3DHI) research and development (R&D) and prototyping.
• Technology roadmap: Overview of 3DHI technology roadmap and design/development infrastructure.
• Progress in action: Hear the latest on facility, infrastructure, equipment, and key milestones in process development.
This in-person meeting will be held on October 27–28, 2025, at The University of Texas at Austin’s AT&T Hotel and Conference Center from 8:30 a.m. to 5:00 p.m. CT on October 27, and from 8:30 a.m. to 1:30 p.m. CT on October 28, 2025.
The NGMM Summit will include overview presentations by government, industry, and academic personnel. There will be time allotted for discussions and networking amongst the participants.
All presentations and discussions will be held at the UNCLASSIFIED level. All attendees are required to present government-issued photo identification upon entry to the event.
Attachments/Links
Contracting Office Address
- 675 NORTH RANDOLPH STREET
- ARLINGTON , VA 222032114
- USA
Primary Point of Contact
- MTO BAA Coordinator
- NGMM_Summit@darpa.mil
Secondary Point of Contact
- Jul 14, 2025 03:21 pm EDTSpecial Notice (Original)
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