Multiple Award PCB Fab and Assembly BPAs 2026-2030

Re-attached PWS document that did not load previously.

DMEA's mission includes developing electronics solutions that solve DOD

obsolescence issues and/or provides state of the art SatCom solutions to

DOD Programs. As such, there is a need to (1) rapidly produce

developmental Printed Circuit Board Assemblies (PCBAs) for initial design

and development use, (2) quickly produce prototype PCBAs for design

validation, and (3) manufacture high quality PCBAs for use in DOD

operational environments.

DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors,

in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of

qualified BPA holders in order to rapidly obtain electronics products from

industry and commercial PCB Fabrication and/or Assembly companies;

specifically those produced by PCB Fabrication and PCB Assembly

processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.)

No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors.

Interested and capable PCB fabrication and/or PCB assembly vendors are

highly encouraged to provide a proposal as instructed herein. Please see

attached combined solicitation/synopsis, PWS for BPA scope, proposal

instructions and evaluation criteria, and DRAFT BPA Agreement language.

Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.