Multichip Module Package for SiC Pressure Sensors
| Agency: | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION |
|---|---|
| State: | Ohio |
| Type of Government: | Federal |
| FSC Category: |
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| NAICS Category: |
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| Posted Date: | Jun 27, 2026 |
| Due Date: | Jun 30, 2026 |
| Solicitation No: | 80NSSC26936730Q |
| Original Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
Description
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- Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
- Original Published Date: Jun 26, 2026 06:04 am CDT
- Original Date Offers Due: Jun 30, 2026 07:00 am CDT
- Inactive Policy: 15 days after date offers due
- Original Inactive Date: Jul 15, 2026
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Initiative:
- None
- Original Set Aside:
- Product Service Code: 6695 - COMBINATION AND MISCELLANEOUS INSTRUMENTS
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NAICS Code:
- 334419 - Other Electronic Component Manufacturing
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Place of Performance:
Cleveland , OH 44135USA
** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors
- JERRY HLASS ROAD, BLDG. 1111
- STENNIS SPACE CENTER , MS 39529
- USA
- Shanna Patterson
- shanna.l.patterson@nasa.gov
- Jun 26, 2026 06:04 am CDTCombined Synopsis/Solicitation (Original)
See Also
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State Government of Ohio
Due by 9/21/2026
Follow AFRL/RFMM PXI Timing, Synchronization, and Data Acquisition System Active Contract Opportunity Notice
DEPT OF DEFENSE
Due by 9/17/2026