Multichip Module Package for SiC Pressure Sensors

Agency: NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
State: Ohio
Type of Government: Federal
FSC Category:
  • 66 - Instruments and Laboratory Equipment
NAICS Category:
  • 334419 - Other Electronic Component Manufacturing
Posted Date: Jun 27, 2026
Due Date: Jun 30, 2026
Solicitation No: 80NSSC26936730Q
Original Source: Please Login to View Page
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Multichip Module Package for SiC Pressure Sensors
Active
Contract Opportunity
Notice ID
80NSSC26936730Q
Related Notice
Department/Ind. Agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office
NASA SHARED SERVICES CENTER
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General Information
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
  • Original Published Date: Jun 26, 2026 06:04 am CDT
  • Original Date Offers Due: Jun 30, 2026 07:00 am CDT
  • Inactive Policy: 15 days after date offers due
  • Original Inactive Date: Jul 15, 2026
  • Initiative:
    • None
Classification
  • Original Set Aside:
  • Product Service Code: 6695 - COMBINATION AND MISCELLANEOUS INSTRUMENTS
  • NAICS Code:
    • 334419 - Other Electronic Component Manufacturing
  • Place of Performance:
    Cleveland , OH 44135
    USA
Description

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors


Attachments/Links
Contact Information
Contracting Office Address
  • JERRY HLASS ROAD, BLDG. 1111
  • STENNIS SPACE CENTER , MS 39529
  • USA
Primary Point of Contact
Secondary Point of Contact


History
  • Jun 26, 2026 06:04 am CDTCombined Synopsis/Solicitation (Original)
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