Montana Microfabrication Facility Chip Bonding Tool

Agency:	State Government of Montana
State:	Montana
Type of Government:	State & Local
Posted Date:	Jan 5, 2026
Due Date:	Jan 16, 2026
Solicitation No:	MSU-IFB-2026-0784
Original Source:	Please Login to View Page
Contact information:	Please Login to View Page
Bid Documents:	Please Login to View Page

The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices.

Open: 1/5/2026 9:00 AM MST

Close: 1/16/2026 2:00 PM MST

Type: IFB

Number: MSU-IFB-2026-0784

Contact:
Mary Hardin mary.hardin1@montana.edu

Contact:
Heather Modroo Heather.Modroo@montana.edu

Details:

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Montana Microfabrication Facility Chip Bonding Tool

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