Montana Microfabrication Facility Chip Bonding Tool
| Agency: | State Government of Montana |
|---|---|
| State: | Montana |
| Type of Government: | State & Local |
| Posted Date: | Jan 5, 2026 |
| Due Date: | Jan 16, 2026 |
| Solicitation No: | MSU-IFB-2026-0784 |
| Original Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
Description
Montana Microfabrication Facility Chip Bonding Tool
Mary Hardin mary.hardin1@montana.edu
Heather Modroo Heather.Modroo@montana.edu
View as PDF
The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices.
Open: 1/5/2026 9:00 AM MST
Close: 1/16/2026 2:00 PM MST
Type: IFB
Number: MSU-IFB-2026-0784
Contact:
Mary Hardin mary.hardin1@montana.edu
Contact:
Heather Modroo Heather.Modroo@montana.edu
Details:
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