High-rate Capacitively Coupled Plasma Atomic Layer Deposition

Oregon State University intends to contract for the provision of a High-rate Capacitively Coupled Plasma Atomic Layer Deposition (CCPALD) from Oxford Instruments as a sole source because of its ability to meet compatibility requirements of an existing line of equipment and the manufacturer being the sole distributor of the goods. The specifications for the CCPALD are:

The high-rate plasma CCPALD must be compatible with the existing Oxford Instruments PlasmaPro 100 Cobra 380 (PP100 platform) already in use at OSU.

Lifetime recipe support for existing and newly developed processes is required, which is an irreplaceable factor for the success of this tool near term and in the future.

A manufacturer must have demonstrated expertise in plasma processing, and a high probability of being positioned to provide tool support over the expected service life of the tool.

Required specifications:

Plasma ALD process module consisting of:
• 240mm biased electrode with 300W RF generator & auto-match unit (AMU), max 400°C with removable cover plate
• Remote plasma source with 600W RF generator & auto-match unit (AMU)
• Chamber backing pump: Pfeiffer A604H
• On-board gas pod configured with:
• 3 × non-toxic lines and 2 × toxic lines
• Thermal ALD water pot
• Precursor cabinet configured for*:
o Line1: Cooled, Vapor Draw, 200 ml pot.
o Line 2: Heated, Bubbled Draw, 200 ml pot.
o Line 3: Heated, Bubbled Draw, 200 ml pot
o Line 4: Heated, Vapor Draw, 200 ml pot
o Line 5: Heated, Vapor Draw, 200 ml pot
o Line 6: Heated, Vapor Draw, 200 ml pot.
• Power supply: 208V
• PC & 22" monitor
• Spare quick-clean kit consisting of process chamber components to facilitate reduced mean time to clean
• Variable wavelength Ocean Optics optical EPD Kit 200-850nm spectrometer integrated into the tool software for endpoint purposes. Process endpointing is achieved by specifying the wavelength to be monitored. The intensities of up to 3 wavelengths can be data logged using the software. Full spectrum data can be viewed and recorded using the software.

Wafer handling module consisting of:
• Single Wafer Loadlock
• Handling module backing pump: Pfeiffer ACP40G
• Configured to handle 50mm, 75mm, 100mm, 125mm, 150 mm or 200 mm wafers
• Glovebox panel

Oxford Instruments is the sole manufacturer and distributor of the equipment and uses proprietary technology to integrate with existing equipment at OSU.

An entity may appeal this determination in accordance with OSU Standard 03-010. Section 5.17 no later than the closing date indicated on the website. Appeals must be submitted to Procurement, Contracts and Materials Management at procurement@oregonstate.edu by Friday, March 28, 2025 at 4:00 pm, PST. For additional information please contact Brian Kinsey by email at brian.kinsey@oregonstate.edu or by telephone at (541) 737-1027.

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