Custom Multi-layer Chips

Agency: ENERGY, DEPARTMENT OF
State: New York
Type of Government: Federal
FSC Category:
  • 59 - Electrical and Electronic Equipment Components
NAICS Category:
  • 334413 - Semiconductor and Related Device Manufacturing
Posted Date: Aug 5, 2025
Due Date: Aug 22, 2025
Solicitation No: RFQ_467991
Original Source: Please Login to View Page
Contact information: Please Login to View Page
Bid Documents: Please Login to View Page

Description

Follow
Custom Multi-layer Chips
Active
Contract Opportunity
Notice ID
RFQ_467991
Related Notice
Department/Ind. Agency
ENERGY, DEPARTMENT OF
Sub-tier
ENERGY, DEPARTMENT OF
Office
BROOKHAVEN NATL LAB -DOE CONTRACTOR
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General Information
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
  • Original Published Date: Aug 05, 2025 05:28 pm EDT
  • Original Date Offers Due: Aug 22, 2025 05:00 pm EDT
  • Inactive Policy: 15 days after date offers due
  • Original Inactive Date: Sep 06, 2025
  • Initiative:
    • None
Classification
  • Original Set Aside:
  • Product Service Code: 5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE
  • NAICS Code:
    • 334413 - Semiconductor and Related Device Manufacturing
  • Place of Performance:
    NY 11973
    USA
Description

Combined Synopsis and Solicitation for Custom Multi-Layer Chips. See attached RFQ letter and enclosures/attachments for details.


Attachments/Links
Contact Information
Contracting Office Address
  • P.O. Box 5000
  • Upton , NY 11973
  • USA
Primary Point of Contact
Secondary Point of Contact


History
  • Aug 05, 2025 05:28 pm EDTCombined Synopsis/Solicitation (Original)
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