Chip Sealing - Summer 2024
| Agency: | Commonwealth of Massachusetts |
|---|---|
| State: | Massachusetts |
| Type of Government: | State & Local |
| NAICS Category: |
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| Posted Date: | Apr 13, 2024 |
| Due Date: | May 1, 2024 |
| Solicitation No: | Please Login to View Page |
| Bid Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
| Bid Description: | Please Login to View Page |
Bid Description contains the detailed information about the bid solicitation including bid documents, specifications, requirements and contact information.
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See Also
Bid Solicitation: BD-22-2110-LELWD-LELWD-101196 Header Information Bid Number: BD-22-2110-LELWD-LELWD-101196 Description: IFB-2024-1 Bid Opening Date:
Commonwealth of Massachusetts
Bid Due: 4/30/2024
Bid Solicitation: BD-24-1202-COCC1-COCC1-100970 Header Information Bid Number: BD-24-1202-COCC1-COCC1-100970 Description: RFP 2024-3 SCATTERED SITE
Commonwealth of Massachusetts
Bid Due: 5/07/2024
Quote Request # Description of service Bid Start date Close/Open date RFP 2024-43OPED
City of Holyoke
Bid Due: 5/16/2024