Automated High Placement Accuracy Flip-Chip Die Bonder

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Contract Opportunity

Amendment 3: Revised Statement of Requirement

After a review of the Government’s minimum requirements, the solicitation is hereby amended. The purpose of this Amendment is two-fold:

1. To incorporate a revised Statement of Requirement dated October 15, 2024.

All revisions have been identified in the revised Statement of Requirement in red font.

2. To provide a new quotation due date, which shall be at 12:00pm EST on October 31, 2024.

To be considered for award, you must submit a new quotation in response to the revised Statement of Requirement (dated 10/15/24). The Government will not accept or evaluate previously submitted quotations. Please submit your best and final quotation no later than the revised due date stated above.

All other terms and conditions remain unchanged.

End of Amendment 3.

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Amendment 2: The purpose of this Amendment is two-fold: 1) to dissolve the total small business set-aside and to compete the requirement as a full and open competition; and 2.) to extend the submission due date for quotations, to 9:00AM EST on August 30, 2024.

All other terms and conditions remain unchanged.

End of Amendment 2.

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Amendment 1: The purpose of this Amendment is two-fold: 1) to provide Government responses to timely submitted vendor questions, and 2) to incorporate a revised Statement of Requirement dated 8/19/24.

Vendor Questions and Government Responses:

Below you will find a list of questions submitted by vendors along with the Government’s responses:

1. Vendor Question: We have a 100 mm X 100 mm substrate heating plate and a 50 mm x 50 mm substrate heating plate. Does this system require both size heating plates?

Government Response: See revised Statement of Requirement. The ability to perform bonding onto 100 mm x 100 mm wafers as well as smaller chips is desired. If a single chuck can be used for both types of substrates, then two chucks are not necessary.

2. Vendor Question: There is no mention of using nitrogen or forming gas in this specification for use with system. Is this a requirement for this system purchase?

Government Response: This is not a requirement for this system purchase.

3. Vendor Question: The current specification requires the automatic die bonder system shall be capable of providing a minimum bonding force of at most 0.1 Newtons to maximum bonding force of at least 2 Newtons. We can offer a force range up to 500 or 1000 Newtons. Please ask your technical expert if they want to go up to either 500 or 1000 Newtons.

Government Response: See revised Statement of Requirement, which states that up to 500 Newtons suffices. A force range for up to 1000 Newtons is not necessary.

4. Vendor Question: We have many Femto2 systems installed in North America. I was going to offer multiple references for past contracts for the Femto2. How many references would you like to see, and can they be commercial and military references? Or only military?

Government Response: Please limit references to five (5) relevant government or non-Government contracts over the past three years.

Revised Statement of Requirement:

See Attachment 1- Statement of Requirement dated 8/19/24.

End of Amendment 1.

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DESCRIPTION:

THIS IS A COMBINED SYNOPSIS/SOLICITATION FOR COMMERCIAL PRODUCTS OR COMMERCIAL SERVICES PREPARED IN ACCORDANCE WITH THE FORMAT IN FAR SUBPART 12.6-STREAMLINED PROCEDURES FOR EVALUATION AND SOLICITATION FOR COMMERCIAL ITEMS-AS SUPPLEMENTED WITH ADDITIONAL INFORMATION INCLUDED IN THIS NOTICE. THIS ANNOUNCEMENT CONSTITUTES THE ONLY SOLICITATION; QUOTATIONS ARE BEING REQUESTED, AND A SEPARATE WRITTEN SOLICITATION WILL NOT BE ISSUED. THE SOLICITATION IS BEING ISSUED USING SIMPLIFIED ACQUISITION PROCEDURES UNDER THE AUTHORITY OF FAR PART 13.5 SIMPLIFIED PROCEDURES FOR CERTAIN COMMERCIAL ITEMS.

This solicitation is a Request for Quotation (RFQ). The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular (FAC) 2024-05 dated May 22, 2024.

The associated North American Industrial Classification System (NAICS) code for this procurement is 334413– Semiconductor and Related Device Manufacturing with a small business size standard of 1,250 employees. This acquisition is being solicited as a full and open competiton.

Contractors must possess an ACTIVE registration in the System for Award Management system, www.SAM.gov, when submitting a quotation and shall continue to be registered until time of award, during performance, and through final payment of any contract resulting from this solicitation. The Contracting Officer will confirm that quoters have an “active” registration at the www.sam.gov website upon receipt of the quotation. If the SAM.gov registration is not active, the quotation will not be considered for award.

BACKGROUND:

The Microsystems and Nanotechnology Division (MND) within the National Institute of Standards and Technology’s (NIST) Physical Measurement Lab (PML) develops integrated microsystems by advancing the state of the art in nanofabrication, thereby enabling the transfer of NIST measurement technologies to the industrial, academic, and government communities. In conjunction with the Quantum Measurement, Quantum Sensors and Nanoscale Device Characterization within the PML, the MND is developing methods to better understand, characterize, and predict the strength of directly bonded dielectric, semiconductor and metallic plasma-treated wafer surfaces that are relevant for current industrial electronic and photonic device fabrication processes. To achieve this goal, a wide range of analytical and metrological techniques will be applied to pre- and post-bond surface-treated wafer pairs and correlated with results from bond strength measurements. New standardized methods for characterizing chip-to-chip bond strength tests will, in addition, be developed.

The investigation will cover parings of various semiconductor, dielectric and metallic surfaces, and is expected to require, for each surface pair combination, a wide range of parameter variations. To support this investigation, an automated flip-chip die bonder is required for performing die-do-die and die-to-wafer bonding in the Center for Nanoscale Science and Technology cleanroom in Gaithersburg, MD.

The objective of this solicitation is to establish a Firm-Fixed-Price purchase order based on the specifications described in the attached Statement of Requirements (SOR).

**Please see attachments for complete details regarding this combined synopsis/solicitation.**

Attachments/Links