Amendment 1 to Automatic Wire Bonder

Agency: COMMERCE, DEPARTMENT OF
State: Maryland
Type of Government: Federal
FSC Category:
  • 66 - Instruments and Laboratory Equipment
NAICS Category:
  • 333242 - Semiconductor Machinery Manufacturing
Set Aside: Total Small Business Set-Aside (FAR 19.5)
Posted Date: Mar 11, 2026
Due Date: Mar 20, 2026
Solicitation No: 1333ND26QNB030043
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Contact information: Please Login to View Page
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Description

Follow
Amendment 1 to Automatic Wire Bonder
Active
Contract Opportunity
Notice ID
1333ND26QNB030043
Related Notice
Department/Ind. Agency
COMMERCE, DEPARTMENT OF
Sub-tier
NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office
DEPT OF COMMERCE NIST
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General Information View Changes
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Updated)
  • Updated Published Date: Mar 10, 2026 03:46 pm EDT
  • Original Published Date: Mar 06, 2026 02:01 pm EST
  • Updated Date Offers Due: Mar 20, 2026 12:00 pm EDT
  • Original Date Offers Due: Mar 20, 2026 12:00 pm EDT
  • Inactive Policy: 15 days after date offers due
  • Updated Inactive Date: Apr 04, 2026
  • Original Inactive Date: Apr 04, 2026
  • Initiative:
    • None
Classification
  • Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
  • Product Service Code: 6640 - LABORATORY EQUIPMENT AND SUPPLIES
  • NAICS Code:
    • 333242 - Semiconductor Machinery Manufacturing
  • Place of Performance:
    Gaithersburg , MD 20899
    USA
Description View Changes

AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions:



Vendor Question 1:



Can you let me know if the parts will be held on flat boats or manually placed on the workholder?



NIST Response:



The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding.



Vendor Question 2:



Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model?



NIST Response:



No



Vendor Question 3:



Application: What type of bonding applications do you plan to run with the new wire bonder?



NIST Response:



We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process



Vendor Question 4:



Bonding Tools: Are there specific bonding tools or configurations required for your applications?



NIST Response:



You will find this information in the Statement of Work.



Vendor Question 5:



Accessories: Will you need additional items such as a microscope, work holders, or any other accessories?



NIST Response:



The tool should contain a scope for inspection and a way to fix the sample piece to the stage.





As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses


Attachments/Links
Contact Information View Changes
Contracting Office Address
  • ACQUISITION MANAGEMENT DIVISION 100 BUREAU DR.
  • GAITHERSBURG , MD 20899
  • USA
Primary Point of Contact
Secondary Point of Contact
History

Related Document

Mar 6, 2026[Combined Synopsis/Solicitation (Updated)] Automatic Wire Bonder
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