Advanced Oxide Etch Tool

Agency: State Government of Florida
State: Florida
Type of Government: State & Local
Posted Date: Aug 6, 2025
Due Date: Aug 29, 2025
Solicitation No: ITB-13542
Original Source: Please Login to View Page
Contact information: Please Login to View Page
Bid Documents: Please Login to View Page
Invitation to Bid Advanced Oxide Etch Tool University of Central Florida
Advertisement Status: OPEN
Last Edit Date/Time: 08/06/2025, 11:34 PM
Advertisement Number: ITB-13542
Agency Advertisement Number: ITB 2025-02OC
Version Number: 1
Published Date/Time: 08/06/2025 11:34 PM
Start Date/Time: 08/06/2025 11:34 PM
End Date/Time:  08/29/2025 03:00 AM
Responses Open Date/Time: 08/07/2025 12:00 AM
Commodity Codes
Code Description
73171601 Scientific instruments or measuring equipment manufacture services

The University of Central Florida is soliciting bids for an advanced oxide etch tool for Inductively Coupled Plasma etching of fused silica wafers. Specifically, for the transfer etching of analog photoresist profiles into fused silica substrates without damage for high optical quality elements at the wafer scale. The required specifications are located on the Bid Sheet (pages 13-14).

  • Questions are due August 14, 2025 at 5:00 PM EST
  • Due Date is August 28, 2025 at 2:00 PM EST

Topic: ITB 2025-02OC Opening on 8/28/2025 at 2:00 PM EST

Join Zoom Meeting
https://ucf.zoom.us/j/92945981510?pwd=ciGX2eR6IsKUefKn2UBXE4dzdac0ai.1

Meeting ID: 929 4598 1510
Passcode: 250910

Please direct all questions to:
Name: Brandon Orofino
Phone: (407) 823-4251
Address: 3544 Perseus Loop #160975 Orlando, FL 32816-0975
Email: Brandon.Orofino@ucf.edu
Description Date/Time
2025-02OC Aug 6, 2025, 11:33:24 PM
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* Disclaimer: This website provides information about bids, requests for proposals (RFPs), or requests for qualifications (RFQs) for convenience only and does not serve as an official public notice. Individuals who wish to respond to or inquire about bids, RFPs, or RFQs should contact the relevant government department directly.

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