Advanced Packaging - Oven, Wafer Dicing Saw and Compression Molding Tools - Center for Neovation Expansion (USDOC EDA Award 04-79-07799)
| Agency: | Osceola County |
|---|---|
| State: | Florida |
| Type of Government: | State & Local |
| NAICS Category: |
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| Posted Date: | Mar 6, 2023 |
| Due Date: | Apr 4, 2023 |
| Solicitation No: | ITB-23-13635-TP |
| Bid Source: | Please Login to View Page |
| Contact information: | Please Login to View Page |
| Bid Documents: | Please Login to View Page |
| agency | number | title | status | broadcast date | question end date | due date | |
| Osceola County Board of County Commissioners | ITB-23-13635-TP | Advanced Packaging - Oven, Wafer Dicing Saw and Compression Molding Tools - Center for Neovation Expansion (USDOC EDA Award 04-79-07799) | Active | 3/5/2023 12:00 PM | 3/17/2023 12:00 PM | 4/4/2023 2:00 PM |
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